GS-830
GS-830 Series
Active CatalogSolderless Breadboard, 830 Tie-Points, with Bus Strip
Solderless Breadboard, 830 tie-points with Bus Strip
$8.501 Year Warranty
Overview
The GS‑830 is a modular solderless breadboard comprising an 830 tie-point breadboard and integrated bus strip. Its compact design and adhesive backing make it ideal for low-frequency or DC circuit prototyping in educational or hobbyist contexts.
Features:
- 830 tie‑points supporting up to 7 standard 16‑pin ICs
- Modular configuration with interlocking tabs and adhesive backing
- ABS plastic body with nickel‑plated phosphor bronze contacts
- Compact dimensions and RoHS‑compliant construction
Applications:
- Educational laboratories
- Hobbyist electronics prototyping
- Modular breadboard configurations for varied circuit layouts
Specifications
- Type
- Passive
- Tie Points
- 830
- Length
- 6.5 in
- Width
- 2.125 in
- Depth
- 0.33 in (8 mm)
- Contact Material
- Nickel plated phosphor bronze
- Insulation Material
- ABS
- Export Control Classification Number (ECCN)
- EAR99
- REACH Compliance
- Compliant
- RoHS Compliance
- RoHS 2 (2015/863/EU) Compliant
- Schedule B Number
- 8536.90.4000
- Country of Origin
- China
- Lead Time
- 95 days
- See More Specifications
- Product Drawing
Documents
- DatasheetDatasheet
- Product DrawingProduct Drawing
- REACH StatementCompany Document
- RoHS DirectiveCompany Document
- PFAS - Certificate of ComplianceCompany Document