Product resources

GS-400
GS-400 Series
Active CatalogSolderless Breadboard, 400 Tie-Points, with Bus Strip
Solderless Breadboard, 400 Tie-points with Bus Strip
$6.251 Year Warranty
Overview
The GS-400 is a compact, modular solderless breadboard ideal for educational and hobbyist prototyping of low-frequency and DC-powered circuits. It combines the GS-300 breadboard with the GS-050 bus strip, providing a reliable and expandable design platform.
Features:
- 400 tie-points with support for 3 16-pin ICs
- Modular structure with interlocking tabs and adhesive backing
- Nickel plated phosphor bronze contacts and ABS plastic body
- Compact form factor with RoHS 2 compliance and 3-year warranty
Applications:
- Educational laboratories
- Hobbyist circuit prototyping
- Modular breadboard configurations
Specifications
- Type
- Passive
- Tie Points
- 400
- Length
- 3.3 in
- Width
- 1.4 in
- Depth
- 0.33 in (8 mm)
- Contact Material
- Nickel plated phosphor bronze
- Insulation Material
- ABS
- Export Control Classification Number (ECCN)
- EAR99
- REACH Compliance
- Compliant
- RoHS Compliance
- RoHS 2 (2015/863/EU) Compliant
- Schedule B Number
- 8536.90.4000
- Country of Origin
- China
- Lead Time
- 95 days
- See More Specifications
- Datasheet
Documents
- DatasheetDatasheet
- REACH StatementCompany Document
- RoHS DirectiveCompany Document
- PFAS - Certificate of ComplianceCompany Document
