Product resources
EXP-355
EXP-355 Series
Active CatalogSolderless Breadboard, 470 Tie-Points
Solderless Breadboard, 470 Tie-points, 8 Mounting Holes
$8.251 Year Warranty
Overview
The EXP‑355 is a modular solderless breadboard with 470 tie‑points and integrated bus strips. It offers expandable circuit design via molded interlocking edge rails, supports up to five 16‑pin DIP ICs, and features heavy‑duty Mylar backing for short‑circuit protection. Ideal for educational and low-frequency circuit prototyping.
Features:
- 470 tie‑points with molded interlocking edge rails for expandable layouts
- Supports up to five 16‑pin ICs
- ABS plastic construction with nickel‑plated phosphor bronze spring clip contacts
- Heavy‑duty Mylar backing to prevent shorts; compact and modular format
Applications:
- Educational laboratories
- Hobbyist and DIY electronics prototyping
- Modular layouts and expandable circuit design
Specifications
- Type
- Passive
- Tie Points
- 470
- Length
- 4.12 in
- Width
- 2.31 in
- Depth
- 0.33 in (8 mm)
- Contact Material
- Nickel plated phosphor bronze
- Insulation Material
- ABS
- Export Control Classification Number (ECCN)
- EAR99
- REACH Compliance
- Compliant
- RoHS Compliance
- RoHS 2 (2015/863/EU) Compliant
- Schedule B Number
- 8537.10.9050
- Country of Origin
- China
- Lead Time
- 95 days
- See More Specifications
- Datasheet
Documents
- DatasheetDatasheet
- REACH StatementCompany Document
- RoHS DirectiveCompany Document
- PFAS - Certificate of ComplianceCompany Document