EXP-350E
EXP-350E Series
Active CatalogSolderless Breadboard, 270 Tie-Points
Solderless Breadboard, 270 Tie-points, 4 Mounting Holes
$5.901 Year Warranty
Overview
The EXP-350E is a compact solderless breadboard offering 270 tie-points, ideal for low-power circuit prototyping. Built from high-impact ABS plastic with nickel-plated phosphor bronze contacts, it features molded interlocking edge rails, integrated bus strips, and mounting holes for flexible configuration. Its robust construction and heavy-duty Mylar backing ensure durability and protection against short circuits.
Features:
- 270 tie-points with 0.3" DIP spacing for IC compatibility
- Interlocking edge rails for modular breadboard expansion
- Heavy-duty Mylar backing eliminates risk of short circuits
- Made with high-impact ABS plastic and phosphor bronze contacts
Specifications
- Type
- Passive
- Tie Points
- 270
- Length
- 3.25 in
- Width
- 1.75 in
- Depth
- 0.33 in (8 mm)
- Contact Material
- Nickel plated phosphor bronze
- Insulation Material
- ABS
- Export Control Classification Number (ECCN)
- EAR99
- REACH Compliance
- Compliant
- RoHS Compliance
- RoHS 2 (2015/863/EU) Compliant
- Schedule B Number
- 8537.10.9050
- Country of Origin
- China
- Lead Time
- 95 days
- See More Specifications
- Product Drawing
Documents
- DatasheetDatasheet
- Product DrawingProduct Drawing
- REACH StatementCompany Document
- RoHS DirectiveCompany Document
- PFAS - Certificate of ComplianceCompany Document