EXP-300E

EXP-300E Series

Active Catalog

Solderless Breadboard, 550 Tie-Points

Solderless Breadboard, 550 Tie-points

$8.501 Year Warranty

Where to Buy

Distributor Availability
DIGIKEY Low Stock Buy Now →
MOUSER ELECTRONICS 2 in stock Buy Now →
TestEquity LLC 2 in stock Buy Now →

Overview

The EXP-300E is a compact solderless breadboard engineered for reliability, durability, and versatility. Built with phosphor bronze contacts and a heavy mylar backing, it is designed to eliminate short circuits and withstand demanding, high-temperature applications. Ideal for prototyping and educational environments, this board provides a robust and efficient platform for electronic circuit development.

Features:

  • Phosphor bronze contacts ensure high conductivity and long service life
  • Heavy mylar backing prevents short circuits during use
  • Durable construction suited for high-temperature applications
  • Backed by a 3-year manufacturer’s warranty

Specifications

Type
Passive
Tie Points
550
Length
1.8 in (46 mm)
Width
5.7 in (145 mm)
Contact Material
Nickel plated phosphor bronze
Insulation Material
ABS
Export Control Classification Number (ECCN)
EAR99
REACH Compliance
Compliant
RoHS Compliance
RoHS 2 (2015/863/EU) Compliant
Schedule B Number
8537.10.9050
Country of Origin
China
Lead Time
95 days
See More Specifications
Datasheet

Documents

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